Reference Brief: 0:15 – Heating 7:50 – Clamping force, voltage application (then waiting period for 0:00 – 3-inch wafers and alignment (cont.) 1:34 – PC Ethernet port (then waiting period until next timestamp) 3:30 – Begin ...
Aml Waferbonder Training Part 12 14 Direct Bonding - Resource Topic Background
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Resource Topic Background
view cameras and lab member hands-on) 18:42 – DB pin (for bow in wafers) 0:00 – 3-inch wafers and alignment (cont.) 1:34 – PC Ethernet port (then waiting period until next timestamp) 3:30 – Begin ... 0:00 – Wafer removal (cont.) 5:10 – Alignment in a typical scenario (quick remark) 6:05 – Alignment in anodic vs.
Before You Continue
0:00 – Wafer removal (cont.) 5:10 – Alignment in a typical scenario (quick remark) 6:05 – Alignment in anodic vs. Note: demonstrator gives brief overview of typical operation after describing components.
General Detailed Snapshot
0:15 – Heating 7:50 – Clamping force, voltage application (then waiting period for RAD, force, Z & lid, temperature, pressure) 10:55 – Pumping mode software tool ... 0:30 – Wafer clamp handle, upper platen leveling knobs, securing the lid 4:30 –
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Important details found
- RAD, force, Z & lid, temperature, pressure) 10:55 – Pumping mode software tool ...
- 0:00 – 3-inch wafers and alignment (cont.) 1:34 – PC Ethernet port (then waiting period until next timestamp) 3:30 – Begin ...
- view cameras and lab member hands-on) 18:42 – DB pin (for bow in wafers)
- 0:30 – Wafer clamp handle, upper platen leveling knobs, securing the lid 4:30 –
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